Thursday May 5th, 2016 | Time: 08:45 - 09:30Bio: Dr. Carl E. McCants received the B.S.E. degree from Duke University, Durham, NC in 1981 and the M.S. and Ph. D. degrees from Stanford University, Stanford, CA in 1982 and 1989, respectively, all in electrical engineering. His doctoral research focused on using photoemission spectroscopy to study metal/III-V semiconductor interface development, and correlate interfacial chemistry with macroscopic electrical properties. He is currently a Program Manager at the Intelligence Advanced Research Projects Activity (IARPA) in the Office of Safe and Secure Operations, and is managing the Rapid Analysis of Various Emerging Nanoelectronics (RAVEN) program, the Circuit Analysis Tools (CAT) program and the Trusted Integrated Chips (TIC) program. From 2010 to 2012, he was a Program Manager in the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO), focused on microelectronic integration and hardware assurance and reliability. The programs he managed included the Integrity and Reliability of Integrated Circuits (IRIS) program, the Trust in Integrated Circuits (TRUST) program, the Gratings of Regular Arrays and Trim Exposures (GRATE) program, the Leading Edge Access Program (LEAP), and the 3-Dimensional Integrated Circuits (3DIC) program.
The Intelligence Advanced Research Projects Activity (IARPA) is actively researching methods for hardware and intellectual property (IP) security through the Trusted Integrated Chips (TIC) Program. In this talk, I will present a perspective on IP security. Starting from an overview of IARPA, I will offer insights on future directions for IP protection using two icons from science fiction, and give a brief description of the TIC program.